| Image | PART NUMBER | Manufacturer | IN STOCK | PACKING | Description | RFQ |
|---|---|---|---|---|---|---|
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DHS-B9090-44A |
Delta Electronics | 3208 | Box | HEATSINK ASSY INTEL LGA1366 |
RFQ |
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HS-XU3-SET-R2 |
Enclustra FPGA Solutions | 2318 | Box | ACC HEATSINK MA-XU3 |
RFQ |
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DHS-B10878-12 |
Delta Electronics | 3966 | Bulk | HEATSINK |
RFQ |
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40432 |
Vicor Corporation | 2878 | Bulk | BOM HEATSINK PUSH PIN LF 4623 |
RFQ |
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40531 |
Vicor Corporation | 2491 | Bulk | HEATSINK 19MM W/ GROUNDING TAB |
RFQ |
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125362 |
Wakefield-Vette | 2889 | Box | 1.45WX36 EXTRUSION 14363 |
RFQ |
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433K |
Wakefield-Vette | 3821 | Bulk | HEATSINK FOR PWR SEMI |
RFQ |
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SKV808012-CU |
Wakefield-Vette | 3633 | Bulk | COPPER HEATSINK 80X80X12MM |
RFQ |
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40483 |
Vicor Corporation | 2702 | Bulk | BOM ASSY 4623 LF PUSH PIN HTSN |
RFQ |
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8-1542002-2 |
TE Connectivity AMP Connectors | 500 | Tray,Tray | 40MM HS ASSY ULTEM CL |
RFQ |
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647058 |
Aavid, Thermal Division of Boyd Corporation | 2613 | Tray | INTEL XEON CPU COOLER 1U |
RFQ |
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302NN |
Wakefield-Vette | 2955 | Bulk | HEATSINK COMPACT |
RFQ |
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40139 |
Vicor Corporation | 2938 | Bulk | BOM, ASSEMBLY, 3623 XF PUSH PI |
RFQ |
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40704 |
Vicor Corporation | 3825 | Bulk | BOM ASSEMBLY HEATSINK TOP 2361 |
RFQ |
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303N |
Wakefield-Vette | 2310 | Bulk | HEATSINK COMPACT |
RFQ |
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2207/PR11B ASSY |
Aavid, Thermal Division of Boyd Corporation | 2074 | Bulk | HEAT SINK |
RFQ |
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DHS-B9292-05A |
Delta Electronics | 3442 | Box | HEATSINK ASSY INTEL LGA2011 |
RFQ |
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441K |
Wakefield-Vette | 2986 | Bulk | HEATSINK HIGH PWR RECT/DIODES |
RFQ |
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DHS-B10878-48 |
Delta Electronics | 2604 | Bulk | HEATSINK |
RFQ |
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1-1542002-1 |
TE Connectivity AMP Connectors | 3355 | Box | HEAT SINK BGA 37.5MM 2FIN RADIAL |
RFQ |
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