| Image | PART NUMBER | Manufacturer | IN STOCK | PACKING | Description | RFQ |
|---|---|---|---|---|---|---|
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658-35ABT1E |
Wakefield-Vette | 2084 | Bulk | HEATSINK CPU 28MM SQBLK W/O TAPE |
RFQ |
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HSE-B18508-060H-W |
CUI Devices | 3337 | Box | HEAT SINK, EXTRUSION,TO-218, 50. |
RFQ |
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657-25ABPE |
Wakefield-Vette | 2432 | Bulk | HEATSINK TO-220 W/PINS BLK 2.5 |
RFQ |
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581002B02100G |
Aavid, Thermal Division of Boyd Corporation | 2148 | Bulk | BOARD LEVEL HEAT SINK |
RFQ |
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658-35ABT5 |
Wakefield-Vette | 3444 | Bulk | HEATSINK CPU 28MM SQ BLK W/TAPE |
RFQ |
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624-60ABT4E |
Wakefield-Vette | 2777 | Bulk | HEATSINK FOR 21MM BGA |
RFQ |
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625-45ABT4E |
Wakefield-Vette | 3551 | Bulk | HEATSINK FOR 25MM BGA |
RFQ |
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625-45ABT5 |
Wakefield-Vette | 3426 | Bulk | HEATSINK FOR 25MM BGA |
RFQ |
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HSE-B18318-0396H |
CUI Devices | 2477 | Box | HEAT SINK, EXTRUSION,TO-218, 31. |
RFQ |
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625-35ABT5 |
Wakefield-Vette | 2108 | Bulk | HEATSINK FOR 25MM BGA |
RFQ |
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658-25ABT6 |
Wakefield-Vette | 3108 | Bulk | HEATSINK CPU 28MM SQ BLK W/TAPE |
RFQ |
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655-26AB |
Wakefield-Vette | 3214 | Bulk | HEATSINK FOR 40MM BGA |
RFQ |
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6273B |
Aavid, Thermal Division of Boyd Corporation | 2748 | Bulk | BOARD LEVEL HEAT SINK |
RFQ |
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658-35ABT6 |
Wakefield-Vette | 2098 | Bulk | HEATSINK CPU 28MM SQ BLK W/TAPE |
RFQ |
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658-45ABT5 |
Wakefield-Vette | 2244 | Bulk | HEATSINK CPU 28MM SQ BLK W/TAPE |
RFQ |
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660-29ABT5 |
Wakefield-Vette | 2927 | Bulk | HEATSINK EXTRUSION 37MM |
RFQ |
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311505A00000G |
Aavid, Thermal Division of Boyd Corporation | 3901 | Bulk | BOARD LEVEL HEAT SINK |
RFQ |
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625-60ABT3 |
Wakefield-Vette | 2728 | Bulk | HEATSINK FOR 25MM BGA |
RFQ |
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DV-T268-101E-TR |
Ohmite | 3934 | Tape & Reel (TR) | TO-268 HEAT SINK /POLY TAPE |
RFQ |
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660-29ABT3 |
Wakefield-Vette | 3485 | Bulk | HEATSINK EXTRUSION 37MM |
RFQ |
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