| Image | PART NUMBER | Manufacturer | IN STOCK | PACKING | Description | RFQ |
|---|---|---|---|---|---|---|
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HSE-B20381-040H |
CUI Devices | 3715 | Box | HEAT SINK, EXTRUSION,TO-220, 38. |
RFQ |
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625-35AB |
Wakefield-Vette | 3498 | Bulk | HEATSINK FOR 25MM BGA |
RFQ |
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HSE-B18381-035H |
CUI Devices | 2347 | Box | HEAT SINK, EXTRUSION, TO-218, 38 |
RFQ |
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630-35AB |
Wakefield-Vette | 3241 | Bulk | HEATSINK FOR 35MM BGA |
RFQ |
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CSM221-12AE |
Ohmite | 3162 | Box | HEATSINK BLACK ANODIZED |
RFQ |
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642-60AB |
Wakefield-Vette | 2088 | Bulk | HEATSINK FOR 35MM BGA |
RFQ |
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529901B00000 |
Aavid, Thermal Division of Boyd Corporation | 2955 | Bulk | BOARD LEVEL HEAT SINK |
RFQ |
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625-35ABT3 |
Wakefield-Vette | 2509 | Bulk | HEATSINK FOR 25MM BGA |
RFQ |
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529902B02100G |
Aavid, Thermal Division of Boyd Corporation | 3679 | Bulk | BOARD LEVEL HEAT SINK |
RFQ |
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HSE-B18635-035H-04 |
CUI Devices | 2869 | Box | HEAT SINK, EXTRUSION, TO-218, 63 |
RFQ |
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642-25ABT3 |
Wakefield-Vette | 3310 | Bulk | HEATSINK FOR 35MM BGA |
RFQ |
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533722B02552G |
Aavid, Thermal Division of Boyd Corporation | 3940 | Bulk | HEAT SINK |
RFQ |
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624-60AB |
Wakefield-Vette | 3771 | Bulk | HEATSINK FOR 21MM BGA |
RFQ |
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659-65AB |
Wakefield-Vette | 3036 | Bulk | HEATSINK EXTRUSION 37MM |
RFQ |
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HSE-B20508-035H-W |
CUI Devices | 3865 | Box | HEAT SINK, EXTRUSION, TO-220, 50 |
RFQ |
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V2136N1-F-LP |
Assmann WSW Components | 2216 | Bulk | HEATSINK CPU W/ADHESIVE STAMPED |
RFQ |
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HSE-B20635-035H |
CUI Devices | 3486 | Box | HEAT SINK, EXTRUSION, TO-220, 63 |
RFQ |
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HSE-B20635-035H-01 |
CUI Devices | 2784 | Box | HEAT SINK, EXTRUSION, TO-220, 63 |
RFQ |
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V2201N1-F |
Assmann WSW Components | 3461 | Bulk | HEATSINK CPU W/ADHESIVE STAMPED |
RFQ |
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HSE-B18254-035H-00 |
CUI Devices | 701 | Bulk,Box | HEAT SINK, EXTRUSION, TO-218, 25 |
RFQ |
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