| Image | PART NUMBER | Manufacturer | IN STOCK | PACKING | Description | RFQ |
|---|---|---|---|---|---|---|
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HSE06-503045 |
CUI Devices | 1197 | Bag | HEAT SINK, EXTRUSION, TO-218/TO- |
RFQ |
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NTE498 |
NTE Electronics, Inc | 532 | Bag | HEATSINK FOR PLASTIC PWR |
RFQ |
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HSE08-505028 |
CUI Devices | 1118 | Bag | HEAT SINK, EXTRUSION, TO-218/TO- |
RFQ |
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V2276E1 |
Assmann WSW Components | 1499 | Bulk | CPU HEATSINK, CROSS CUT, AL6063 |
RFQ |
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HSB27-434316 |
CUI Devices | 1081 | Box | HEAT SINK, BGA, 43.1 X 43.1 X 16 |
RFQ |
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ATS-PCB1056 |
Advanced Thermal Solutions Inc. | 379 | Bulk | HEATSINK TO-218/TO-247 ALUMINUM |
RFQ |
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HSE02-173213P |
CUI Devices | 1572 | Box | HEAT SINK, EXTRUSION, 17 X 31.9 |
RFQ |
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TGH-0510-01 |
t-Global Technology | 204 | Bulk | ALUMINIUM HEAT SINK 51X35MM |
RFQ |
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TGH-0280-07 |
t-Global Technology | 158 | Bulk | ALUMINIUM HEAT SINK 28X28MM |
RFQ |
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NTE448B |
NTE Electronics, Inc | 270 | Bag | CLIP-ON H/S FOR 14/16 DIP |
RFQ |
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RPIHS-01 |
OSEPP Electronics LTD | 605 | Retail Package | RASPBERRY PI LOW PROF HEAT SINK |
RFQ |
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XL25D-TO247-22-17-0.64 |
t-Global Technology | 121 | Bulk | CERAMIC HEAT SPREADER 22X17X0.63 |
RFQ |
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XL25D-TO220-20-14-0.64 |
t-Global Technology | 107 | Bulk | CERAMIC HEAT SPREADER 20X14X0.63 |
RFQ |
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ATS-PCB1037 |
Advanced Thermal Solutions Inc. | 1486 | Bulk | HEATSINK TO-220 W/TAB BLACK |
RFQ |
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TGH-0350-03 |
t-Global Technology | 107 | Bulk | ALUMINIUM HEAT SINK 35X35MM |
RFQ |
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HSE07-753045 |
CUI Devices | 993 | Bag | HEAT SINK, EXTRUSION, TO-218/TO- |
RFQ |
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TGH-0260-02 |
t-Global Technology | 1000 | Bulk | ALUMINIUM HEAT SINK 26X26MM |
RFQ |
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TGH-0300-03 |
t-Global Technology | 183 | Bulk | ALUMINIUM HEAT SINK 30X30MM |
RFQ |
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HSE09-755028 |
CUI Devices | 999 | Bag | HEAT SINK, EXTRUSION, TO-218/TO- |
RFQ |
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V2271E1 |
Assmann WSW Components | 1449 | Bulk | CPU HEATSINK, CROSS CUT, AL6063 |
RFQ |
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